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    Micro-transfer-printable flip-chip structures and methods
    2.
    发明授权
    Micro-transfer-printable flip-chip structures and methods 有权

    公开(公告)号：US10431487B2

    公开(公告)日：2019-10-01

    申请号：US16192779

    申请日：2018-11-15

    申请人： X-Celeprint Limited

    发明人： Christopher Bower ,  Matthew Meitl ,  António José Marques Trindade ,  Ronald S. Cok ,  Brook Raymond ,  Carl Prevatte

    IPC分类号： H01L21/683 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L23/00

    摘要： In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.

    Heterogeneous light emitter display system
    4.
    发明授权
    Heterogeneous light emitter display system 有权

    公开(公告)号：US10380930B2

    公开(公告)日：2019-08-13

    申请号：US14834042

    申请日：2015-08-24

    申请人： X-Celeprint Limited

    发明人： Ronald S. Cok ,  Christopher Bower ,  Matthew Meitl

    IPC分类号： G09G5/02 ,  G09G3/20 ,  G09G3/3208 ,  H01L27/32

    摘要： A heterogeneous light-emitter display includes a display substrate having a plurality of pixels disposed thereon. Each pixel including at least a first heterogeneous multiple-component sub-pixel emitting a first color of light and a second sub-pixel emitting a second color of light different from the first color. A heterogeneous light-emitter display can also include an array of heterogeneous pixels. Each heterogeneous pixel includes a plurality of first pixels and a plurality of second pixels. The first sub-pixel of each of the first pixels includes a first light emitter and the first sub-pixel of each of the second pixels includes a second light emitter different from the first light emitter. One or more pixel controllers control the pixels, the first and second pixels, the first and second sub-pixels, and the first and second light emitters.

    OLEDs for micro transfer printing
    6.
    发明授权
    OLEDs for micro transfer printing 有权

    公开(公告)号：US10230048B2

    公开(公告)日：2019-03-12

    申请号：US14869369

    申请日：2015-09-29

    申请人： X-Celeprint Limited

    发明人： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok

    IPC分类号： H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  H01L27/32

    摘要： An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.

    Chiplets with wicking posts
    8.
    发明授权
    Chiplets with wicking posts 有权

    公开(公告)号：US10222698B2

    公开(公告)日：2019-03-05

    申请号：US15662214

    申请日：2017-07-27

    申请人： X-Celeprint Limited

    发明人： Carl Prevatte ,  Christopher Bower ,  Matthew Meitl

    IPC分类号： H01L23/00 ,  G03F7/20 ,  H05K3/30

    摘要： A printable component includes a component substrate and one or more electrical conductors. One or more electrically conductive connection posts protrudes from the component substrate to form an exposed electrical contact. Each connection post is electrically connected to at least one of the electrical conductors and one or more wicking posts protrude from the component substrate. The wicking post can be insulating. In certain embodiments, a printable component source wafer comprises a source wafer, a plurality of sacrificial portions separated by anchor portions formed in a sacrificial layer of the source wafer, and a plurality of printable components. Each printable component is disposed over a corresponding sacrificial portion and connected to an anchor portion by a tether. A destination substrate structure comprises a destination substrate having one or more electrically conductive contact pads, an adhesive layer disposed on the destination substrate, and one or more printable components.

    Efficiently micro-transfer printing micro-scale devices onto large-format substrates
    9.
    发明授权
    Efficiently micro-transfer printing micro-scale devices onto large-format substrates 有权

    公开(公告)号：US10217730B2

    公开(公告)日：2019-02-26

    申请号：US15440756

    申请日：2017-02-23

    申请人： X-Celeprint Limited

    发明人： Christopher Bower ,  Matthew Meitl

    IPC分类号： H01L25/16 ,  H01L33/62 ,  H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L23/00

    摘要： A method of making a micro-transfer printed system includes providing a source wafer having a plurality of micro-transfer printable source devices arranged at a source spatial density; providing an intermediate wafer having a plurality of micro-transfer printable intermediate supports arranged at an intermediate spatial density less than or equal to the source spatial density; providing a destination substrate; micro-transfer printing the source devices from the source wafer to the intermediate supports of the intermediate wafer with a source stamp having a plurality of posts at a source transfer density to make an intermediate device on each intermediate support; and micro-transfer printing the intermediate devices from the intermediate wafer to the destination substrate at a destination spatial density less than the source spatial density with an intermediate stamp having a plurality of posts at an intermediate transfer density less than the source transfer density.