Invention Grant
- Patent Title: Single wire communication board-to-board interconnect
-
Application No.: US15473330Application Date: 2017-03-29
-
Publication No.: US10366035B2Publication Date: 2019-07-30
- Inventor: Arvind Sundaram , Ramaswamy Parthasarathy , Vikas Mishra
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01P3/10
- IPC: H01P3/10 ; G06F13/40 ; H01P5/08 ; G06F13/42 ; H01P5/02

Abstract:
A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.
Public/Granted literature
- US20180287239A1 SINGLE WIRE COMMUNICATION BOARD-TO-BOARD INTERCONNECT Public/Granted day:2018-10-04
Information query