- 专利标题: Air gap spacer with controlled air gap height
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申请号: US15884934申请日: 2018-01-31
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公开(公告)号: US10367076B1公开(公告)日: 2019-07-30
- 发明人: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Cantor Colburn LLP
- 代理商 Vazken Alexanian
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L31/062 ; H01L29/66 ; H01L21/762 ; H01L29/06 ; H01L29/417 ; H01L29/78 ; H01L29/49
摘要:
A FinFET and method for fabricating an air gap spacer in a FinFET is disclosed. The FinFET includes a sidewall spacer between a gate material and an interlayer dielectric material. The sidewall spacer includes a lower portion that extends fully between the gate and the interlayer dielectric material and an upper portion that includes an airgap. The sidewall spacer is fabricated by depositing a sacrificial gate structure in a gate region having an upper sacrificial layer and a lower sacrificial layer, and removing the upper sacrificial layer to expose a sidewall spacer region. Airgap spacer material is deposited in the exposed sidewall spacer region to form an upper portion of the sidewall spacer having the air gap.
公开/授权文献
- US20190237560A1 AIR GAP SPACER WITH CONTROLLED AIR GAP HEIGHT 公开/授权日:2019-08-01
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