Invention Grant
- Patent Title: Semiconductor device, manufacturing method thereof, module, and electronic device
-
Application No.: US15814925Application Date: 2017-11-16
-
Publication No.: US10367096B2Publication Date: 2019-07-30
- Inventor: Shunpei Yamazaki , Shinya Sasagawa , Satoru Okamoto , Motomu Kurata , Yuta Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2015-150866 20150730
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/12 ; H01L29/786 ; H01L29/66 ; H01L29/423 ; H01L27/12 ; H01L21/8258 ; H01L27/06 ; H01L21/66

Abstract:
A semiconductor device which includes a transistor having a miniaturized structure is provided. A first insulator is provided over a stack in which a semiconductor, a first conductor, and a second conductor are stacked in this order. Over the first insulator, an etching mask is formed. Using the etching mask, the first insulator and the second conductor are etched until the first conductor is exposed. After etching the first conductor until the semiconductor is exposed so as to form a groove having a smaller width than the second conductor, a second insulator and a third conductor are formed sequentially.
Public/Granted literature
- US20180076332A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, MODULE, AND ELECTRONIC DEVICE Public/Granted day:2018-03-15
Information query
IPC分类: