Invention Grant
- Patent Title: Light emitting device
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Application No.: US15620730Application Date: 2017-06-12
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Publication No.: US10367129B2Publication Date: 2019-07-30
- Inventor: Satoshi Shichijo , Kunihito Sugimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi, Tokushima
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi, Tokushima
- Agency: Foley & Lardner LLP
- Priority: JP2016-118337 20160614
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L27/15 ; H01L33/48 ; H01L33/50 ; H01L33/60 ; H01L33/62 ; H01L25/075

Abstract:
A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.
Public/Granted literature
- US20170358724A1 LIGHT EMITTING DEVICE Public/Granted day:2017-12-14
Information query
IPC分类: