Invention Grant
- Patent Title: Ultrasonic probe
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Application No.: US14613769Application Date: 2015-02-04
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Publication No.: US10368845B2Publication Date: 2019-08-06
- Inventor: Kyungil Cho , Jong Keun Song , Seungheun Lee , Baehyung Kim , Youngil Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0044454 20140414
- Main IPC: A61B8/00
- IPC: A61B8/00

Abstract:
Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.
Public/Granted literature
- US20150289852A1 ULTRASONIC PROBE Public/Granted day:2015-10-15
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