公开(公告)号：US10080550B2

公开(公告)日：2018-09-25

申请号：US14684497

申请日：2015-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Baehyung Kim ,  Youngil Kim ,  Jong Keun Song ,  Seungheun Lee ,  Taeho Jeon ,  Kyungil Cho

IPC: A61B8/00 ,  G01N29/07 ,  A61B8/13 ,  A61B8/08 ,  G01S15/89 ,  G01S7/52

CPC classification number: A61B8/5253 ,  A61B8/4483 ,  G01S7/52036 ,  G01S7/52049 ,  G01S7/52071 ,  G01S15/8915 ,  G01S15/8993 ,  G01S15/8995

Abstract: Disclosed herein are an ultrasonic apparatus for imaging an ultrasonic signal and a control method for the same. The ultrasonic apparatus may include a transducer configured to irradiate a plurality of ultrasonic waves which have different traveling directions onto an object and to collect a plurality of echo ultrasonic waves reflected from the object; and a controller configured to acquire a plurality of sound velocities of the plurality of ultrasonic waves in the object and to compound the acquired plurality of sound velocities in order to determine a composite sound velocity in the object.

公开(公告)号：US10368845B2

公开(公告)日：2019-08-06

申请号：US14613769

申请日：2015-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungil Cho ,  Jong Keun Song ,  Seungheun Lee ,  Baehyung Kim ,  Youngil Kim

IPC: A61B8/00

Abstract: Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.