公开(公告)号：US10258311B2

公开(公告)日：2019-04-16

申请号：US14823108

申请日：2015-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungil Cho ,  Minseog Choi ,  Youngil Kim ,  Jong Keun Song

IPC: A61B8/00 ,  A61B8/08 ,  G01S15/89 ,  B06B1/06 ,  G01S7/52

Abstract: A probe includes a transducer array including a transducer element, the transducer element including cells connected in parallel to each other, and a current detector configured to apply a voltage to the cells of the transducer element, or to output an electrical signal based on currents output from the cells.

公开(公告)号：US10085717B2

公开(公告)日：2018-10-02

申请号：US14808326

申请日：2015-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungil Cho ,  Jong Keun Song

IPC: A61B8/00

Abstract: An ultrasonic probe includes: a housing having an opening provided at a first end portion of the housing; a transducer provided in a position corresponding to the opening and configured to generate ultrasonic waves; a heat spreader provided underneath the transducer; and a printed circuit board (PCB) disposed between the transducer and the heat spreader, wherein the heat spreader includes: a body portion configured to absorb heat from the transducer; and a coupling portion that is formed at a side portion of the body portion and coupled to the housing.

公开(公告)号：US10292680B2

公开(公告)日：2019-05-21

申请号：US14694489

申请日：2015-04-23

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Kyungpook National University Industry-Academic Cooperation Foundation

Inventor： Youngil Kim ,  Jong Keun Song ,  Baehyung Kim ,  Yongrae Roh ,  Eunsung Lee ,  Kyungil Cho ,  Minseog Choi

IPC: A61B8/00 ,  B06B1/02 ,  B06B1/06 ,  B06B1/08 ,  G01S15/89

Abstract: An ultrasonic probe includes a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves, an integrated circuit to which the cMUT array is bonded, and a flexible printed circuit board having one end connected to the integrated circuit to output signals to the integrated circuit, the integrated circuit including pads provided on the integrated circuit and an anisotropic conductive film (ACF) provided on the pads, and the one end of the flexible printed circuit board being connected to the ACF to thereby connect the flexible printed circuit board to the integrated circuit.

公开(公告)号：US10080550B2

公开(公告)日：2018-09-25

申请号：US14684497

申请日：2015-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Baehyung Kim ,  Youngil Kim ,  Jong Keun Song ,  Seungheun Lee ,  Taeho Jeon ,  Kyungil Cho

IPC: A61B8/00 ,  G01N29/07 ,  A61B8/13 ,  A61B8/08 ,  G01S15/89 ,  G01S7/52

CPC classification number: A61B8/5253 ,  A61B8/4483 ,  G01S7/52036 ,  G01S7/52049 ,  G01S7/52071 ,  G01S15/8915 ,  G01S15/8993 ,  G01S15/8995

Abstract: Disclosed herein are an ultrasonic apparatus for imaging an ultrasonic signal and a control method for the same. The ultrasonic apparatus may include a transducer configured to irradiate a plurality of ultrasonic waves which have different traveling directions onto an object and to collect a plurality of echo ultrasonic waves reflected from the object; and a controller configured to acquire a plurality of sound velocities of the plurality of ultrasonic waves in the object and to compound the acquired plurality of sound velocities in order to determine a composite sound velocity in the object.

公开(公告)号：US10368845B2

公开(公告)日：2019-08-06

申请号：US14613769

申请日：2015-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungil Cho ,  Jong Keun Song ,  Seungheun Lee ,  Baehyung Kim ,  Youngil Kim

IPC: A61B8/00

Abstract: Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.

公开(公告)号：US10054677B2

公开(公告)日：2018-08-21

申请号：US14740535

申请日：2015-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhong Kim ,  Baehyung Kim ,  Suhyun Park ,  Jong Keun Song ,  Kyungil Cho

IPC: G01S7/52 ,  G10K11/34

CPC classification number: G01S7/52023 ,  G01S7/52025 ,  G01S7/52047 ,  G01S7/5208 ,  G10K11/346

Abstract: A beamforming apparatus includes: a signal output unit configured to output signals; a time difference corrector configured to correct a time difference between the signals; and a weight applier configured to apply a weight value to the signals, according to an error between the signals with the corrected time difference and a target delay pattern.