Invention Grant
- Patent Title: Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material
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Application No.: US15757002Application Date: 2016-09-09
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Publication No.: US10371612B2Publication Date: 2019-08-06
- Inventor: Keiko Kashihara , Hiroharu Inoue , Shingo Yoshioka , Takashi Hoshi
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2015-187575 20150925
- International Application: PCT/JP2016/004107 WO 20160909
- International Announcement: WO2017/051510 WO 20170330
- Main IPC: B32B5/28
- IPC: B32B5/28 ; C08J5/24 ; G01N3/18 ; H05K1/02 ; H05K1/03 ; H05K3/06 ; B32B15/08 ; B32B37/10 ; B32B38/00
Abstract:
A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
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