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公开(公告)号：US11945910B2
公开(公告)日：2024-04-02
申请号：US16978599
申请日：2019-03-11
Inventor： Hiroaki Umehara , Rihoko Watanabe , Hiroharu Inoue , Yiqun Wang
IPC: B32B3/10 , B32B15/08 , C08F222/40 , C08G65/48 , C08J5/24 , C08L25/06 , C08L47/00 , C08L71/12 , C08L79/08 , H05K1/03
CPC classification number: C08G65/485 , B32B15/08 , C08F222/40 , C08J5/244 , C08J5/249 , C08L25/06 , C08L47/00 , C08L71/126 , C08L79/08 , H05K1/0326 , H05K1/0346 , B32B2457/08 , C08F212/36 , C08F222/406
Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) a maleimide compound represented by the following formula (1):
wherein in the formula, p represents an integer of 1 to 10, in which the content ratio of the component (A) to the component (B) is (A):(B)=50:50 to 90:10 in mass ratio.-
公开(公告)号：US12122129B2
公开(公告)日：2024-10-22
申请号：US16977384
申请日：2019-03-11
Inventor： Hiroaki Umehara , Rihoko Watanabe , Hiroharu Inoue , Yiqun Wang
IPC: B32B27/28 , B32B15/08 , C08F112/08 , C08F120/14 , C08F222/40 , C08J5/04 , C08J5/18 , C08J5/24 , C08L71/12
CPC classification number: B32B27/281 , B32B15/08 , C08F112/08 , C08F120/14 , C08F222/404 , C08J5/043 , C08J5/18 , C08J5/244 , C08J5/249 , C08L71/126 , B32B2250/02 , B32B2250/03 , B32B2457/08 , C08F2810/40 , C08J2371/12 , C08F290/06 , C08F222/40
Abstract: One aspect of the present invention relates to a resin composition containing (A) a thermosetting compound having a styrene structure or a (meth)acrylate structure, and (B) at least one of maleimide compounds represented by the formulas (1) to (3).
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公开(公告)号：US11407869B2
公开(公告)日：2022-08-09
申请号：US16466979
申请日：2017-12-07
Inventor： Keiko Kashihara , Rihoko Watanabe , Hiroharu Inoue
Abstract: Disclosed herein is a prepreg including a woven fabric base and a semi-cured product of a resin composition impregnated into the woven fabric base. The resin composition contains a maleimide resin as Component (A), an acrylic resin as Component (B), and a phenol resin as Component (C). The Component (B) has a weight average molecular weight falling within the range from 200,000 to 850,000.
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公开(公告)号：US11365274B2
公开(公告)日：2022-06-21
申请号：US16978564
申请日：2019-03-11
Inventor： Hiroaki Umehara , Yiqun Wang , Hiroharu Inoue
IPC: C08F290/06 , C08J5/24 , B32B15/08 , H05K1/05
Abstract: A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
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公开(公告)号：US11059260B2
公开(公告)日：2021-07-13
申请号：US16316579
申请日：2017-07-19
Inventor： Keiko Kashihara , Takashi Hoshi , Hiroharu Inoue
IPC: B32B5/02 , B32B15/14 , C08J5/24 , H05K1/03 , B32B15/08 , B32B15/092 , C08L63/00 , C08K3/36 , C08K5/5399 , C08K9/06
Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).
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Patent Agency Ranking
公开(公告)号：US09894761B2
公开(公告)日：2018-02-13
申请号：US15173697
申请日：2016-06-05
Inventor： Takashi Hoshi , Takeshi Kitamura , Keiko Kashihara , Hiroharu Inoue
CPC classification number: H05K1/0366 , B32B15/14 , B32B2260/046 , C08G59/62 , C08J5/24 , C08J2363/00 , C08J2433/02 , C08J2433/06 , C08J2433/08 , C08L63/00 , H05K1/0271 , H05K1/0373 , H05K2201/0133 , H05K2201/0209 , H05K2201/0224 , H05K2201/029
Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).
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公开(公告)号：US11866580B2
公开(公告)日：2024-01-09
申请号：US16957232
申请日：2018-10-16
Inventor： Hiroaki Umehara , Fumito Suzuki , Jun Yasumoto , Hiroharu Inoue
IPC: C08L71/12 , C08K5/00 , C08K5/3492 , C08J5/24
CPC classification number: C08L71/126 , C08J5/244 , C08K5/0025 , C08K5/34924 , C08L2203/16 , C08L2203/202 , C08L2205/025 , C08L2312/00
Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
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公开(公告)号：US12173151B2
公开(公告)日：2024-12-24
申请号：US18517442
申请日：2023-11-22
Inventor： Hiroaki Umehara , Fumito Suzuki , Jun Yasumoto , Hiroharu Inoue
IPC: C08L71/12 , C08J5/24 , C08K5/00 , C08K5/3492
Abstract: One aspect of the present application relates to a polyphenylene ether resin composition including a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule, the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) having a specific structure, and a modified polyphenylene ether compound (A-2) having a specific structure.
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公开(公告)号：US12098257B2
公开(公告)日：2024-09-24
申请号：US17626881
申请日：2020-07-16
Inventor： Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
IPC: C08J5/24 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/28 , B32B27/34 , B32B27/36 , B32B27/38 , C08L63/08 , H05K1/03 , H05K3/02
CPC classification number: C08J5/249 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/286 , B32B27/288 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , C08J5/24 , C08L63/08 , H05K1/0353 , H05K1/036 , H05K3/022 , B32B2260/046 , B32B2307/206 , B32B2457/04 , B32B2457/08 , C08J2363/08 , C08J2453/00 , C08J2471/12 , C08L2205/03
Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent.
In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
In Formula (2), R4 represents a hydrogen atom or an alkyl group.-
公开(公告)号：US11905409B2
公开(公告)日：2024-02-20
申请号：US18112837
申请日：2023-02-22
Inventor： Kosuke Tsuda , Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
CPC classification number: C08L71/126 , C08J5/18 , C08J5/249 , C08K3/36 , H05K1/0373 , C08J2371/12 , C08J2425/16 , C08J2453/02 , C08L2203/16
Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
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