公开(公告)号：US10371612B2

公开(公告)日：2019-08-06

申请号：US15757002

申请日：2016-09-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Keiko Kashihara ,  Hiroharu Inoue ,  Shingo Yoshioka ,  Takashi Hoshi

IPC: B32B5/28 ,  C08J5/24 ,  G01N3/18 ,  H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  B32B15/08 ,  B32B37/10 ,  B32B38/00

Abstract: A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.

公开(公告)号：US11059260B2

公开(公告)日：2021-07-13

申请号：US16316579

申请日：2017-07-19

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Keiko Kashihara ,  Takashi Hoshi ,  Hiroharu Inoue

IPC: B32B5/02 ,  B32B15/14 ,  C08J5/24 ,  H05K1/03 ,  B32B15/08 ,  B32B15/092 ,  C08L63/00 ,  C08K3/36 ,  C08K5/5399 ,  C08K9/06

Abstract: A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).

公开(公告)号：US09894761B2

公开(公告)日：2018-02-13

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Hoshi ,  Takeshi Kitamura ,  Keiko Kashihara ,  Hiroharu Inoue

IPC: H05K1/03 ,  H05K1/02 ,  C08J5/24 ,  C08G59/62 ,  C08L63/00

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).