Invention Grant
- Patent Title: Thermal interface
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Application No.: US15457717Application Date: 2017-03-13
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Publication No.: US10371909B2Publication Date: 2019-08-06
- Inventor: Troy Wy Piew Chiang , Julia Koh , Tat Ming Teo , William H. Wang
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H05K7/20 ; H04B10/50

Abstract:
A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
Public/Granted literature
- US20170261711A1 THERMAL INTERFACE Public/Granted day:2017-09-14
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