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公开(公告)号：US11631962B2
公开(公告)日：2023-04-18
申请号：US16870542
申请日：2020-05-08
Applicant: FINISAR CORPORATION
Inventor： Hao Chen
Abstract: A light source includes a substrate with a first surface and an opposite second surface. An epitaxial layer is positioned on the first surface of the substrate. The light source also includes at least one light generator in the epitaxial layer positioned such that an optical signal transmitted thereby is directed toward the substrate. A diffuser is positioned on the second surface of the substrate, and at least one monitor photodetector is positioned in the epitaxial layer in an arrangement configured to receive a portion of the optical signal which is reflected by the diffuser. In one form, the light generator may include a vertical cavity surface emitting laser (VCSEL).
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公开(公告)号：US11555973B2
公开(公告)日：2023-01-17
申请号：US16993846
申请日：2020-08-14
Applicant: FINISAR CORPORATION
Inventor： Tao Chen , Cheng Jie Dong , Jin Jiang , Ting Shi , Shao Jun Yu , You Ji Liu
Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one example, an optoelectronic assembly may include a printed circuit board including a laser-roughened area, at least one optoelectronic component coupled to a surface of the printed circuit board, and an optical component attached to the printed circuit board. The coupling area may be defined by the optical component contacting the printed circuit board, and the laser-roughened area may be positioned entirely within the coupling area defined by the optical component contacting the printed circuit board.
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公开(公告)号：US11489310B2
公开(公告)日：2022-11-01
申请号：US15947630
申请日：2018-04-06
Applicant: Finisar Corporation
Inventor： Hongdang He
IPC: H01S3/00 , G01R21/06 , H01L27/146 , G01R29/08 , H04B10/564 , H01S5/0683 , G01R31/26 , H01S5/40 , H04B10/40
Abstract: A system and method for measuring optical power is described. The optical system and method may include a module configured to generate a secondly modulated signal based on secondly modulating a firstly modulated signal with an amplitude modulated signal. The firstly modulated signal may include data that is modulated for transmission by a laser diode array. The firstly modulated signal may then be secondly modulated using amplitude modulation techniques. The system may further include a photodiode configured to generate a photodiode current based on optically sensing a laser diode array. The laser diode array outputs an optical output power based on being driven by the secondly modulated signal. The system may yet further include a controller configured to calculate the optical output power from the photodiode current based on the amplitude modulated signal.
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公开(公告)号：US11320611B2
公开(公告)日：2022-05-03
申请号：US16859752
申请日：2020-04-27
Applicant: FINISAR CORPORATION
Inventor： Qing Qian , Wei Li , Hui Juan Yan , Hui Yang , Wei Peng Nian , Ting Shi
Abstract: The present disclosure generally relates to printed circuit boards or printed circuit board assemblies for fiber optic communications. In one non-limiting embodiment, a method of assembling an optoelectronic assembly includes providing a printed circuit board with a first metal coating and an optical component with a second metal coating. The method further includes positioning the optical component relative to the printed circuit board with at least some portion of the first metal coating aligned with or adjacent to at least some portion of the second metal coating, and applying solder between the first metal coating and the second metal coating to couple the optical component and the printed circuit board.
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公开(公告)号：US11295994B2
公开(公告)日：2022-04-05
申请号：US16517404
申请日：2019-07-19
Applicant: FINISAR CORPORATION
Inventor： Shiyun Lin , Daniel Mahgerefteh , Bryan Park , Jin-Hyoung Lee
Abstract: A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.
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Patent Agency Ranking
公开(公告)号：US20210325615A1
公开(公告)日：2021-10-21
申请号：US16854502
申请日：2020-04-21
Applicant: FINISAR CORPORATION
Inventor： William H. Wang , Bill S. Wang
Abstract: In an example, an optoelectronic module may include a housing enclosing at least one optical transmitter or receiver and a slider configured to move with respect to the housing. The slider may include at least one protrusion configured to engage a cage sized and shaped to receive the housing. The optoelectronic module may include a bail rotatably coupled to the housing, and the bail may be configured to actuate the slider when the bail is rotated. The optoelectronic module may include a retainer configured to engage with the housing and the bail to retain the bail in a fixed position with respect to the housing.
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公开(公告)号：US11057984B2
公开(公告)日：2021-07-06
申请号：US16199484
申请日：2018-11-26
Applicant: Finisar Corporation
Inventor： Steven C. Bird , Henry Meyer Daghighian
IPC: H05K1/02 , H05K3/00 , H05K3/40 , H05K1/18 , H01S5/024 , H01S5/02253 , H01S5/02325 , H01S5/02345 , H01S5/183
Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
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公开(公告)号：US10996394B2
公开(公告)日：2021-05-04
申请号：US16379660
申请日：2019-04-09
Applicant: FINISAR CORPORATION
Inventor： Daniel Mahgerefteh , Jared Mikkelsen
Abstract: An integrated optical component includes at least one input waveguide, at least one output waveguide; a first slab waveguide having a first refractive index, n1. The first slab waveguide may be disposed between at least one of the input waveguides and at least one of the output waveguides. The integrated optical component may further include a second slab waveguide having a second refractive index, n2. The integrated optical component may also include a third cladding slab having a third refractive index, n3. The third cladding slab may be disposed between the first slab and the second slab. The thickness of the second slab waveguide and the thickness of the third slab waveguide are adjustable to reduce a birefringence of the integrated optical component.
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公开(公告)号：US20210109297A1
公开(公告)日：2021-04-15
申请号：US16600256
申请日：2019-10-11
Applicant: Finisar Corporation
Inventor： Peng Chen , Chong Heng , Huaping Peng , Shamei Shi , William H. Wang , Feng Xu , Ranran Zhang , Naizhi Zhao , Long Van Nguyen
Abstract: An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.
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公开(公告)号：US10931435B2
公开(公告)日：2021-02-23
申请号：US16293412
申请日：2019-03-05
Applicant: FINISAR CORPORATION
Inventor： Jason Y. Miao
Abstract: A system may include a clock and data recovery circuit that includes one or more analog components. The system may also include processing circuitry configured to control the clock and data recovery circuit. The processing circuitry and the clock and data recovery circuit may be formed on a single substrate.
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