Invention Grant
- Patent Title: Memory load to load fusing
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Application No.: US15615811Application Date: 2017-06-06
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Publication No.: US10372452B2Publication Date: 2019-08-06
- Inventor: Paul E. Kitchin , Rama S. Gopal , Karthik Sundaram
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F9/35 ; G06F12/0875 ; G06F9/38

Abstract:
A system and a method to cascade execution of instructions in a load-store unit (LSU) of a central processing unit (CPU) to reduce latency associated with the instructions. First data stored in a cache is read by the LSU in response a first memory load instruction of two immediately consecutive memory load instructions. Alignment, sign extension and/or endian operations are performed on the first data read from the cache in response to the first memory load instruction, and, in parallel, a memory-load address-forwarded result is selected based on a corrected alignment of the first data read in response to the first memory load instruction to provide a next address for a second of the two immediately consecutive memory load instructions. Second data stored in the cache is read by the LSU in response to the second memory load instruction based on the selected memory-load address-forwarded result.
Public/Granted literature
- US20180267800A1 MEMORY LOAD TO LOAD FUSING Public/Granted day:2018-09-20
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