Invention Grant
- Patent Title: Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure
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Application No.: US15468911Application Date: 2017-03-24
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Publication No.: US10373863B2Publication Date: 2019-08-06
- Inventor: Yuichiro Goto , Tadashi Oomatsu
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-201568 20140930
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L21/768 ; H01L21/027 ; H01L21/3205 ; H01L23/532 ; B29C44/02 ; B29C44/12 ; H01L21/02 ; H01L23/522 ; H01L23/528 ; B29C37/00 ; B29K33/00 ; B29K105/00 ; B29L31/34 ; B29K105/04
Abstract:
Provided are a method of manufacturing a porous body capable of easily manufacturing a porous body, a porous body, a method of manufacturing a device, a device, a method of manufacturing a wiring structure, and a wiring structure.A photocurable composition including a condensing gas and a polymerizable compound is applied to a substrate or a mold, the photocurable composition is sandwiched between the substrate and the mold and then the photocurable composition is irradiated with light to cure the photocurable composition, and the mold is released from a surface of the cured photocurable composition.
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