Invention Grant
- Patent Title: Transistor structure
-
Application No.: US15813945Application Date: 2017-11-15
-
Publication No.: US10373872B2Publication Date: 2019-08-06
- Inventor: Shih-Yin Hsiao , Ching-Chung Yang , Kuan-Liang Liu
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW106135221A 20171013
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/02 ; H01L21/8234 ; H01L29/49 ; H01L29/78 ; H01L21/8249

Abstract:
A transistor structure includes a source region and a drain region disposed in a substrate, extending along a first direction. A polysilicon layer is disposed over the substrate, extending along a second direction perpendicular to the first direction, wherein the polysilicon layer includes a first edge region, a channel region and a second edge region formed as a gate region between the source region and the drain region in a plane view. The polysilicon layer has at least a first opening pattern at the first edge region having a first portion overlapping with the gate region; and at least a second opening pattern at the second edge region having a second portion overlapping with the gate region.
Public/Granted literature
- US20190115260A1 TRANSISTOR STRUCTURE Public/Granted day:2019-04-18
Information query
IPC分类: