Invention Grant
- Patent Title: Feeder-cover structure and semiconductor production apparatus
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Application No.: US14597312Application Date: 2015-01-15
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Publication No.: US10374358B2Publication Date: 2019-08-06
- Inventor: Ryota Sakane , Dai Kitagawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2014-014607 20140129
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01R13/53 ; H01R13/631 ; C23C16/458 ; C23C16/509 ; H01R103/00
Abstract:
A feeder-cover structure includes a power feeder including a socket and a plug fitted together, a cover structure that covers and seals the power feeder, and a supply mechanism that supplies dry air or an inert gas into the cover structure. A gap is formed between the power feeder and the cover structure such that the dry air or the inert gas is supplied through the gap into the cover structure.
Public/Granted literature
- US20150214653A1 FEEDER-COVER STRUCTURE AND SEMICONDUCTOR PRODUCTION APPARATUS Public/Granted day:2015-07-30
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