Invention Grant
- Patent Title: Sensor module and method of manufacturing the same
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Application No.: US15385287Application Date: 2016-12-20
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Publication No.: US10378931B2Publication Date: 2019-08-13
- Inventor: Hartmut Rudmann , Markus Rossi
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee: ams Sensors Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Fish & Richardson P.C.
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G01D5/30 ; G01S17/88 ; G01S7/481 ; H01L31/0203 ; H01L31/0232 ; G01L9/00 ; H01L27/144 ; H01L31/173 ; H01L31/18

Abstract:
The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.
Public/Granted literature
- US20170153128A1 SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-06-01
Information query
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