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公开(公告)号：US11686886B2
公开(公告)日：2023-06-27
申请号：US16935641
申请日：2020-07-22
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Dmitry Bakin , Markus Rossi , Kai Engelhardt
CPC classification number: G02B3/04 , G02B13/003 , G02B13/18 , G02B13/008 , G02B13/16
Abstract: This disclosure describes illumination assemblies operable to generate a patterned illumination that maintain high contrast over a wide temperature range. An implementation of the illumination assembly can include an array of monochromatic light sources positioned on an illumination plane, first and second optical elements, and an exit aperture. A chief ray of each light source within the array of monochromatic light sources can substantially converge at an exit aperture. In such implementations light generated by the array of monochromatic light sources can be used efficiently.
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公开(公告)号：US11067446B2
公开(公告)日：2021-07-20
申请号：US16625612
申请日：2018-06-18
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Peter Roentgen , Kotaro Ishizaki , Camilla Camarri , Markus Rossi , Elisa Parola , Bassam Hallal
Abstract: Compact spectrometer modules include an illumination channel and a detection channel. The illumination channel includes an illumination source operable to generate a broad spectrum of electromagnetic radiation. The detection channel includes an illumination detector and a Fabry-Perot component. The Fabry-Perot component is operable to pass a narrow spectrum of wavelengths to the illumination detector. Further, the Fabry-Perot component can be actuatable such that the Fabry-Perot component is operable to pass a plurality of narrow spectrums of wavelengths to the illumination detector.
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公开(公告)号：US20210014429A1
公开(公告)日：2021-01-14
申请号：US17013287
申请日：2020-09-04
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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公开(公告)号：US20200320725A1
公开(公告)日：2020-10-08
申请号：US16650120
申请日：2018-09-25
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Markus Rossi , Florin Cutu
Abstract: An optoelectronic system for collecting three-dimensional data of a scene over a minimum and maximum distance includes illumination modules, each of which is operable to generate a respective light pattern having a respective period. An imaging module is operable to collect a scene-reflected portion of each of the light patterns and is further operable to convert each collected portion into a respective signal set. Each scene-reflected portion is characterized by a respective plurality of ambiguity values and a minimum disparity value, and wherein each signal set corresponds to a respective one of the light patterns. The system includes a processor, and a non-transitory computer-readable medium comprising instructions stored thereon that, when executed by the processor, cause the processor to perform operations for determining a plurality of candidate three-dimensional data sets. Each candidate three-dimensional data set is determined from a respective one of the signal sets. The instructions also cause the processor to perform further operations for determining three-dimensional data of the scene from the plurality of candidate three-dimensional data sets.
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公开(公告)号：US10741736B2
公开(公告)日：2020-08-11
申请号：US15473935
申请日：2017-03-30
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Simon Gubser , Mario Cesana , Markus Rossi , Hartmut Rudmann
IPC: H01L33/56 , H01L31/0232 , H01L27/146 , H01L23/00 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/58 , H01L51/52 , H01L51/56 , H01S5/00 , H01S5/02 , H01S5/183 , H01L31/0216 , H01L33/44 , H01L33/48 , H01L33/54
Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.
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Patent Agency Ranking
公开(公告)号：US10343899B2
公开(公告)日：2019-07-09
申请号：US14346804
申请日：2012-10-01
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Peter Riel , Hartmut Rudmann , Markus Rossi
IPC: H01L27/146 , B81B7/04 , B81C1/00
Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub-wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.
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7.发明授权公开(公告)号：US10295657B2
公开(公告)日：2019-05-21
申请号：US15689079
申请日：2017-08-29
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bernhard Buettgen , Jens Geiger , Michael Kiy , Oliver Chidley , Markus Rossi
Abstract: A time of flight-based system is operable for ambient light measurements. A method of operation includes detecting, in at least one active demodulation detection pixel, a first particular wavelength and generating amplitude data of the first particular wavelength; and detecting, in at least one spurious reflection detection pixel, a second particular wavelength and generating amplitude data of the second particular wavelength. In a computational device that stores spectrum data corresponding respectively to a plurality of different ambient light source types, an ambient lighting condition is determined based on the amplitude data of the first particular wavelength, the amplitude data of the second particular wavelength and the spectrum data of a particular one of the ambient light source types associated with the amplitude data of the first particular wavelength and the amplitude data of the second particular wavelength.
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8.发明授权公开(公告)号：US11073642B2
公开(公告)日：2021-07-27
申请号：US16334239
申请日：2017-09-15
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Markus Rossi , Hartmut Rudmann , Bassam Hallal
Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.
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公开(公告)号：US10378931B2
公开(公告)日：2019-08-13
申请号：US15385287
申请日：2016-12-20
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Hartmut Rudmann , Markus Rossi
IPC: H01L27/146 , G01D5/30 , G01S17/88 , G01S7/481 , H01L31/0203 , H01L31/0232 , G01L9/00 , H01L27/144 , H01L31/173 , H01L31/18
Abstract: The opto-electronic module (1) comprises a first substrate member (P); a third substrate member (B); a second substrate member (O) arranged between said first and third substrate members and comprising one or more transparent portions (ta, tb) through which light can pass, said at least one transparent portion comprising at least a first optical structure (5a;5a′;5b;5b′); a first spacer member (S1) comprised in said first substrate member (P) or comprised in said second substrate member (O) or distinct from and located between these, which comprises at least one opening (4a;4b); a second spacer member (S2) comprised in said second substrate member (O) or comprised in said third substrate member (B) or distinct from and located between these, which comprises at least one opening (3); a light detecting element (D) arranged on and electrically connected to said first substrate member (P); a light emission element (E) arranged on and electrically connected to said first substrate member (P); and a sensing element (8) comprised in or arranged at said third substrate member (B). Such modules (1) are particularly suitable as sensor modules for sensing a magnitude such as a pressure.
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公开(公告)号：US11575843B2
公开(公告)日：2023-02-07
申请号：US17013287
申请日：2020-09-04
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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