Invention Grant
- Patent Title: Apparatus and method for chucking warped wafers
-
Application No.: US15065430Application Date: 2016-03-09
-
Publication No.: US10381256B2Publication Date: 2019-08-13
- Inventor: Pradeep Subrahmanyan , Luping Huang , Chris Pohlhammer
- Applicant: KLA-TENCOR CORPORATION
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Simpson & Simpson, PLLC
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67

Abstract:
An apparatus for fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.
Public/Granted literature
- US20160268156A1 APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS Public/Granted day:2016-09-15
Information query
IPC分类: