Invention Grant
- Patent Title: Apparatus of processing workpiece in depressurized space
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Application No.: US15363141Application Date: 2016-11-29
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Publication No.: US10381258B2Publication Date: 2019-08-13
- Inventor: Takuya Umise , Hiroshi Sone , Naoyuki Suzuki
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2015-235652 20151202; JP2016-042020 20160304
- Main IPC: H01L21/687
- IPC: H01L21/687

Abstract:
In a processing apparatus according to one embodiment, a stage is installed inside a process chamber. The stage has a plurality of through-holes formed therein, which corresponds to a plurality of lift pins. The plurality of lift pins is supported by a spline shaft through a support body. The spline shaft is supported by a spline bearing such that the spline shaft is vertically moved. The plurality of lift pins is biased upward by a spring member through the spline shaft. The spline shaft, the spline bearing, and the spring member are installed in an outer space separated from a depressurizable inner space of the process chamber.
Public/Granted literature
- US20170162424A1 APPARATUS OF PROCESSING WORKPIECE IN DEPRESSURIZED SPACE Public/Granted day:2017-06-08
Information query
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