公开(公告)号：US10381258B2

公开(公告)日：2019-08-13

申请号：US15363141

申请日：2016-11-29

申请人： TOKYO ELECTRON LIMITED

发明人： Takuya Umise ,  Hiroshi Sone ,  Naoyuki Suzuki

IPC分类号： H01L21/687

摘要： In a processing apparatus according to one embodiment, a stage is installed inside a process chamber. The stage has a plurality of through-holes formed therein, which corresponds to a plurality of lift pins. The plurality of lift pins is supported by a spline shaft through a support body. The spline shaft is supported by a spline bearing such that the spline shaft is vertically moved. The plurality of lift pins is biased upward by a spring member through the spline shaft. The spline shaft, the spline bearing, and the spring member are installed in an outer space separated from a depressurizable inner space of the process chamber.

公开(公告)号：US10468237B2

公开(公告)日：2019-11-05

申请号：US16029847

申请日：2018-07-09

申请人： Tokyo Electron Limited

发明人： Atsushi Gomi ,  Tetsuya Miyashita ,  Shinji Furukawa ,  Koji Maeda ,  Masamichi Hara ,  Naoyuki Suzuki ,  Hiroshi Miki ,  Toshiharu Hirata

IPC分类号： H01J37/32 ,  C23C14/56 ,  H01L21/67 ,  H01L21/677 ,  H01L43/12

摘要： An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.

公开(公告)号：US20180315585A1

公开(公告)日：2018-11-01

申请号：US16029847

申请日：2018-07-09

申请人： Tokyo Electron Limited

发明人： Atsushi Gomi ,  Tetsuya Miyashita ,  Shinji Furukawa ,  Koji Maeda ,  Masamichi Hara ,  Naoyuki Suzuki ,  Hiroshi Miki ,  Toshiharu Hirata

IPC分类号： H01J37/32 ,  H01L21/67

CPC分类号： H01J37/32733 ,  C23C14/566 ,  C23C14/568 ,  H01J37/32899 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67745 ,  H01L43/12

摘要： An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.

公开(公告)号：US09787222B2

公开(公告)日：2017-10-10

申请号：US14721408

申请日：2015-05-26

申请人： Tokyo Electron Limited

发明人： Kaoru Yamamoto ,  Shinji Orimoto ,  Naoyuki Suzuki

IPC分类号： H02N13/00 ,  H01L21/683 ,  H01L21/687

CPC分类号： H02N13/00 ,  H01L21/6833 ,  H01L21/68742 ,  H01L21/6875

摘要： Provided is an electrostatic attraction apparatus in which a first insulating layer is formed on a base in an electrostatic chuck. A first portion of the first insulating layer extends on a first face of the base and a second portion of the first insulating layer extends on at least a portion of a second face of the base. An attraction electrode is formed on the first portion of the first insulating layer. A second insulating layer is formed on the first portion of the first insulating layer and the attraction electrode. A conductor pattern extends from the attraction electrode and provides a power supply terminal on the second portion of the first insulating layer. A contact part of a terminal member urged by an urging unit is in contact with the power supply terminal. The terminal member is connected with a wiring line connected to a supply power.

公开(公告)号：US09673078B2

公开(公告)日：2017-06-06

申请号：US14721452

申请日：2015-05-26

申请人： TOKYO ELECTRON LIMITED

发明人： Tetsuya Miyashita ,  Masamichi Hara ,  Naoyuki Suzuki ,  Kaoru Yamamoto ,  Kouji Maeda

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/6833 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6875

摘要： A cooling processing apparatus includes: a processing vessel; an electrostatic chuck installed in the processing vessel, the electrostatic chuck having a mounting surface on which an object to be processed is mounted; a cooling mechanism configured to cool the electrostatic chuck; and a lamp heating device configured to remove moisture attached to the mounting surface. Further, a method for operating the cooling processing apparatus includes: decompressing the space in the processing vessel by using the exhaust device; removing the moisture attached to the mounting surface of the electrostatic chuck by using the lamp heating device; and cooling the electrostatic chuck by using the cooling mechanism after the removal of the moisture performed by the lamp heating device is terminated.

公开(公告)号：US11417504B2

公开(公告)日：2022-08-16

申请号：US16660696

申请日：2019-10-22

申请人： Tokyo Electron Limited

发明人： Manabu Nakagawasai ,  Naoyuki Suzuki ,  Shinji Orimoto ,  Hiroyuki Yokohara ,  Motoi Yamagata ,  Koji Maeda

IPC分类号： H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/54 ,  H01L21/683 ,  H01F41/32 ,  H01L43/12 ,  H01J37/34 ,  H01L21/673

摘要： A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.

公开(公告)号：US20190390326A1

公开(公告)日：2019-12-26

申请号：US16442721

申请日：2019-06-17

申请人： Tokyo Electron Limited

发明人： Junichi Takei ,  Naoyuki Suzuki ,  Hiroshi Sone ,  Shinji Orimoto

IPC分类号： C23C14/50 ,  C23C14/34

摘要： A substrate stage includes: a shaft rotatably disposed with respect to a bottom surface of a processing container; a base provided on the shaft; and a horizontal mover attached to the base and configured to move a substrate in the processing container in a horizontal direction with respect to the bottom surface.

公开(公告)号：US10392688B2

公开(公告)日：2019-08-27

申请号：US15832591

申请日：2017-12-05

申请人： TOKYO ELECTRON LIMITED

发明人： Junichi Takei ,  Naoyuki Suzuki ,  Tetsuya Miyashita

IPC分类号： C23C14/04 ,  C23C14/50 ,  H01J37/32 ,  C23C14/00 ,  C23C14/34 ,  H01J37/34 ,  H01L21/677

摘要： A film forming apparatus includes: a chamber main body defining a chamber; a slit plate partitioning the chamber into a first space and a second space below the first space, the slit plate having a slit penetrating therethrough; a holder holding a target in the first space; a stage for supporting a substrate, the stage being movable in a moving direction perpendicular to a longitudinal direction of the slit in a moving area including an area directly below the slit; and a mechanism for moving the stage along the moving direction. In order to suppress scattering of particles from the target to another area other than the moving area in the second space through the slit, the stage has one or more protruding portions which provide upwardly and/or downwardly bent portions in a path around the stage between the slit and the another area in the second space.

公开(公告)号：US11764092B2

公开(公告)日：2023-09-19

申请号：US17779873

申请日：2020-11-20

申请人： Tokyo Electron Limited

发明人： Tatsuo Hatano ,  Tetsuya Miyashita ,  Naoki Watanabe ,  Naoyuki Suzuki

IPC分类号： H01L21/677 ,  B25J9/02 ,  B25J9/12 ,  B25J11/00 ,  H02K7/14 ,  H02K41/02 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/67742 ,  B25J9/02 ,  B25J9/12 ,  B25J11/0095 ,  H02K7/14 ,  H02K41/02 ,  H01L21/67167 ,  H01L21/67748 ,  H01L21/68707

摘要： The substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein; a transfer unit movable on the planar motor; and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.

公开(公告)号：US11605547B2

公开(公告)日：2023-03-14

申请号：US16819287

申请日：2020-03-16

申请人： Tokyo Electron Limited

发明人： Manabu Nakagawasai ,  Naoyuki Suzuki ,  Shinji Orimoto ,  Hiroyuki Yokohara

IPC分类号： H01L21/67 ,  G01K13/00 ,  H01L21/687

摘要： A temperature measuring device that measures a temperature of a rotatable stage that holds a substrate, includes: a contact portion provided at a position that does not hinder placing of the substrate on the stage, and a temperature detector having a temperature sensor, and provided at a position separated from the temperature detection contact portion except when measuring a temperature. When measuring the temperature of the stage, the temperature detection contact portion and the temperature detector are relatively moved and brought into contact with each other in a state where the stage is not rotating to detect the temperature of the stage.