Invention Grant
- Patent Title: Method and system for providing a reverse-engineering resistant hardware embedded security module
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Application No.: US15927239Application Date: 2018-03-21
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Publication No.: US10381315B2Publication Date: 2019-08-13
- Inventor: Harsono S. Simka , Ganesh Hegde , Joon Goo Hong , Rwik Sengupta , Mark S. Rodder
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L23/00 ; H01L23/522 ; H01L27/02 ; H04L9/32 ; H01L23/532
Abstract:
A hardware-embedded security system is described. The system includes connective components, circuit elements and an insulator. The connective components include a variable conductivity layer that is conductive for a first stoichiometry and insulating for a second stoichiometry. The variable conductivity layer is conductive for a first portion of the connective components connected to a first portion of the circuit elements. The variable conductivity layer is insulating for a second portion of the connective components connected to a second portion of the circuit elements. Thus, the first portion of the circuit elements are active and the second portion of the circuit elements are inactive. The insulator is adjacent to at least a portion of each of the connective components. The first stoichiometry may be indistinguishable from the second stoichiometry via optical imaging and electron imaging of a portion of the insulator and the variable conductivity layer.
Public/Granted literature
- US20190148312A1 METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HARDWARE EMBEDDED SECURITY MODULE Public/Granted day:2019-05-16
Information query
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