A configuration of components formed on a semiconductor structure is provided. A non-limiting example of the configuration includes a substrate having a first section doped with a first dopant and a second section doped with a second dopant. The configuration further includes an insulator interposed between the first and second sections. A first fin extends upwardly from the first section, and second and third fins extend upwardly from the second section. A conductor is configured to be shared between proximal gates operably interposed between the first and second fins. A dielectric material is configured to separate proximal gates operably interposed between the second and third fins.