Invention Grant
- Patent Title: Wafer level packaging, optical detection sensor and method of forming same
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Application No.: US15969908Application Date: 2018-05-03
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Publication No.: US10381504B2Publication Date: 2019-08-13
- Inventor: Yonggang Jin , Wee Chin Judy Lim
- Applicant: STMicroelectronics Pte Ltd
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Crowe & Dunlevy
- Main IPC: H01L31/16
- IPC: H01L31/16 ; H01L31/0232 ; H01L31/18 ; H03K17/94 ; H03K17/96 ; H01L31/167 ; G01S17/02 ; G01S7/481 ; H01L25/16 ; G01V8/12 ; H01L21/56

Abstract:
An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
Public/Granted literature
- US20180248068A1 WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME Public/Granted day:2018-08-30
Information query
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