Invention Grant
- Patent Title: Light emitting device
-
Application No.: US15701857Application Date: 2017-09-12
-
Publication No.: US10381520B2Publication Date: 2019-08-13
- Inventor: Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2012-202952 20120914
- Main IPC: H01L33/44
- IPC: H01L33/44 ; H01L33/62 ; H01L25/075 ; H05K1/18 ; H05K3/00 ; F21V21/08 ; F21S4/24 ; H01L33/08 ; H01L33/56 ; H01L33/54 ; F21Y103/10 ; F21Y115/10 ; F21Y101/02 ; F21Y103/00

Abstract:
A light emitting device includes a flexible substrate, at least one light emitting element, a sealing resin, an adhesion layer and a support member. The flexible substrate includes a flexible base member and a plurality of wiring portions disposed on one surface of the base member. At least one light emitting element is arranged on a first surface of the flexible substrate and electrically connected to the wiring portions. The sealing resin seals the at least one light emitting element. The adhesion layer and the support member are arranged in this order on a second surface of the flexible substrate different from the first surface of the flexible substrate. The support member has a recess in a region corresponding at least to a region on the first surface where the at least one light emitting element is arranged.
Public/Granted literature
- US20180006201A1 LIGHT EMITTING DEVICE Public/Granted day:2018-01-04
Information query
IPC分类: