公开(公告)号：US12158659B2

公开(公告)日：2024-12-03

申请号：US18453095

申请日：2023-08-21

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: G02F1/13357

Abstract: A planar light source includes a substrate, a reflective member having a plurality of openings and at least one slit, and a light source disposed in each of the openings. The plurality of openings are arranged in m rows along a first direction and in n columns along a second direction that intersects the first direction. The at least one slit includes at least one first slit arranged in a first region and intersecting a first virtual straight line at a prescribed position in the first region. The first virtual straight line is parallel to the first direction. The first region is located between one or more openings in a kth row (k is an integer equal to or greater than 1 and less than or equal to m−1) and one or more openings in a (k+1)th row and extends in the first direction.

公开(公告)号：US11585516B2

公开(公告)日：2023-02-21

申请号：US17400001

申请日：2021-08-11

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: G02F1/13357 ,  F21V7/22 ,  F21V9/30 ,  F21V7/00 ,  F21V13/08 ,  G02F1/1335 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; first and second prism array layers stacked with each other; a dichroic layer positioned between the first and second prism array layers and the plurality of light sources; and a wavelength conversion layer positioned between the first and second prism array layers and the dichroic layer.

公开(公告)号：US11515296B2

公开(公告)日：2022-11-29

申请号：US17382699

申请日：2021-07-22

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  G02F1/13357 ,  H01L33/46 ,  F21V7/00 ,  F21V9/08 ,  F21V23/00 ,  H01L33/58 ,  H01L33/56 ,  G02F1/1335 ,  F21Y115/10

Abstract: A light-emitting device includes a base including a conductive wiring; a light-emitting element mounted on the base and configured to emit light; a light reflective film provided on an upper surface of the light-emitting element; and a encapsulant covering the light-emitting element and the light reflective film. A ratio (H/W) of a height (H) of the encapsulant to a width (W) of a bottom surface of the encapsulant is less than 0.5.

公开(公告)号：US10763408B2

公开(公告)日：2020-09-01

申请号：US16442412

申请日：2019-06-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/54 ,  H01L33/44 ,  H01L33/10 ,  F21V8/00 ,  H01L33/50 ,  H01L25/075

Abstract: A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emitting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.

公开(公告)号：US10527257B2

公开(公告)日：2020-01-07

申请号：US15705057

申请日：2017-09-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Takeshi Tamura ,  Hiroshi Fujimori

IPC: F21V7/22 ,  G02F1/1335 ,  F21V9/30 ,  F21V13/08 ,  F21V7/00 ,  G02F1/13357 ,  F21Y115/30 ,  F21Y105/16 ,  F21Y115/10

Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.

公开(公告)号：US10451225B2

公开(公告)日：2019-10-22

申请号：US15337786

申请日：2016-10-28

Applicant: NICHIA CORPORATION

Inventor： Tomonori Ozaki ,  Motokazu Yamada

IPC: F21K9/60 ,  F21V23/00 ,  F21Y113/13 ,  F21Y105/18 ,  F21Y105/16 ,  F21Y115/10 ,  F21V3/06

Abstract: A lighting module includes a mounting board; a plurality of first light sources located on the mounting board; and one or more second light sources located on the mounting board. A wavelength range and/or a correlated color temperature of the plurality of first light sources is different from a wavelength range and/or a correlated color temperature of the one or more second light sources. A quantity of the first light sources is greater than a quantity of the one or more second light sources. A light distribution angle of each of the one or more second light sources is greater than a light distribution angle of each of the plurality of first light sources.

公开(公告)号：US10317050B2

公开(公告)日：2019-06-11

申请号：US15901765

申请日：2018-02-21

Applicant: NICHIA CORPORATION

Inventor： Yasuo Fujikawa ,  Takuya Wasa ,  Tomohiro Ikeda ,  Yohei Inayoshi ,  Motokazu Yamada

IPC: F21V11/00 ,  F21V19/00 ,  H01L25/075 ,  G02F1/13357 ,  G02F1/1335 ,  F21Y113/00 ,  F21Y105/16 ,  F21Y103/10 ,  F21Y115/10 ,  H05K1/18

Abstract: A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.

公开(公告)号：US09920907B2

公开(公告)日：2018-03-20

申请号：US15340990

申请日：2016-11-02

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: F21V13/14 ,  F21V9/08 ,  F21V19/00 ,  F21V7/00 ,  F21V5/04 ,  F21V15/01 ,  F21V3/00

CPC classification number: F21V13/14 ,  F21V3/00 ,  F21V3/10 ,  F21V3/12 ,  F21V5/04 ,  F21V7/0083 ,  F21V7/22 ,  F21V9/08 ,  F21V9/30 ,  F21V15/01 ,  F21V19/005 ,  F21Y2113/13 ,  F21Y2115/10

Abstract: A light emitting device includes a base having a light reflecting surface and having a first side on which the light reflecting surface is provided, light sources mounted on the first side, and a half mirror disposed opposite to the base to reflect a part of incident light and to transmit another part of the incident light. Each of the light sources includes a reflecting layer on an upper surface of each of the light sources. The half mirror has an oblique reflectance with respect to wavelengths of light emitted from the light sources in a case where the light travels obliquely toward the half mirror. The half mirror has a perpendicular reflectance with respect to the wavelengths in a case where the light travels perpendicularly toward the half mirror. The oblique reflectance is smaller than the perpendicular reflectance.

公开(公告)号：US09887329B2

公开(公告)日：2018-02-06

申请号：US14884718

申请日：2015-10-15

Applicant: Nichia Corporation

Inventor： Motokazu Yamada

IPC: H01L33/60 ,  H01L23/00 ,  H01L33/62 ,  H01L33/00 ,  H01L33/50 ,  H01L25/16 ,  H01L33/52 ,  H01L25/075 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

公开(公告)号：US09806234B2

公开(公告)日：2017-10-31

申请号：US14610030

申请日：2015-01-30

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Mototaka Inobe ,  Kunihiro Izuno

IPC: H01L33/56 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L33/46 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48465 ,  H01L2224/4945 ,  H01L2924/01322 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method of manufacturing a light emitting device includes a first step of mounting a light emitting element on a substrate having a conductor wiring and electrically connecting the light emitting element with the conductor wiring, a second step of disposing a light reflecting resin which reflects light from the light emitting element to surround the light emitting element, and a third step of disposing a sealing member after hardening the light reflecting resin to cover the light emitting element.