Invention Grant
- Patent Title: Wireless power transfer through a metal object
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Application No.: US14616021Application Date: 2015-02-06
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Publication No.: US10381875B2Publication Date: 2019-08-13
- Inventor: Seong Heon Jeong , Mei-Li Chi , Curtis Gong , David George Fern , Francesco Carobolante
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H02J50/12
- IPC: H02J50/12 ; H02J7/02 ; H02J5/00 ; H04B5/00 ; G06F1/16 ; G06F1/26 ; H01F38/14

Abstract:
A method and system for providing wireless power transfer through a metal object is provided. In one aspect, an apparatus for wirelessly receiving power via a magnetic field is provided. The apparatus includes a metal cover including an inner portion and an outer portion. The outer portion is configured to form a loop around the inner portion of the metal cover. The outer portion is configured to inductively couple power via the magnetic field. The apparatus includes a receive circuit electrically coupled to the outer portion and configured to receive a current from the outer portion generated in response to the magnetic field. The receive circuit is configured to charge or power a load based on the current.
Public/Granted literature
- US20160006293A1 WIRELESS POWER TRANSFER THROUGH A METAL OBJECT Public/Granted day:2016-01-07
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