Invention Grant
- Patent Title: Assembly of integrated circuit modules and method for identifying the modules
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Application No.: US16203402Application Date: 2018-11-28
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Publication No.: US10382042B2Publication Date: 2019-08-13
- Inventor: Roeland Vandebriel , Geert Van der Plas , Vladimir Cherman
- Applicant: IMEC vzw
- Applicant Address: BE Leuven
- Assignee: IMEC vzw
- Current Assignee: IMEC vzw
- Current Assignee Address: BE Leuven
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: EP17204275 20171129
- Main IPC: H03K21/02
- IPC: H03K21/02 ; G11C5/04 ; G11C7/20 ; H03K5/153 ; H01L25/065

Abstract:
An assembly including a carrier substrate and at least one group of interconnected integrated circuit modules mounted thereon is disclosed. The modules are provided with a connection for transmitting a clock signal through the group of interconnected modules. The modules are also provided with digital input ports and output ports and a logic circuit configured for identifying the position of the modules in the group on the basis of a count of the clock pulses, and on the basis of the logic state of the input and output ports. In one aspect, a method involves the transfer of a token in the form of one or more logic states, through the group of modules, from a first module to a last module, resulting in the identification of all modules in a progressive manner.
Public/Granted literature
- US20190165791A1 ASSEMBLY OF INTEGRATED CIRCUIT MODULES AND METHOD FOR IDENTIFYING THE MODULES Public/Granted day:2019-05-30
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