Various embodiments include methods for performing temperature calibration of a first temperature sensitive unit with an electronic device having a first processing unit that is thermally coupled to the first temperature sensitive unit. Various embodiments may include determining a current temperature of the first temperature sensitive unit, determining a processing load for the first processing unit based on the current temperature and a target temperature, applying the determined processing load to the first processing unit to vary a temperature of the first temperature sensitive unit, and determining a temperature bias for the first temperature sensitive unit at the temperature of the first temperature sensitive unit based on an output of the first temperature sensitive unit.