Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15908851Application Date: 2018-03-01
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Publication No.: US10388797B2Publication Date: 2019-08-20
- Inventor: Shunpei Yamazaki , Hideomi Suzawa
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2014-055157 20140318
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/06 ; H01L27/1156 ; H01L27/12 ; H01L29/16 ; H01L29/78 ; H01L29/06 ; H01L29/24

Abstract:
Provided is a highly integrated semiconductor device, a semiconductor device with large storage capacity with respect to an area occupied by a capacitor, a semiconductor device capable of high-speed writing, a semiconductor device capable of high-speed reading, a semiconductor device with low power consumption, or a highly reliable semiconductor device. The semiconductor device includes a first transistor, a second transistor, and a capacitor. A conductor penetrates and connects the first transistor, the capacitor, and the second transistor. An insulator is provided on a side surface of the conductor that penetrates the capacitor.
Public/Granted literature
- US20180190828A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-07-05
Information query
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