Invention Grant
- Patent Title: Light emitting package
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Application No.: US15863146Application Date: 2018-01-05
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Publication No.: US10388841B2Publication Date: 2019-08-20
- Inventor: Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2012-0087167 20120809
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/64 ; H01L33/48

Abstract:
A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
Public/Granted literature
- US20180130934A1 LIGHT EMITTING PACKAGE Public/Granted day:2018-05-10
Information query
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