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公开(公告)号：US09842975B2
公开(公告)日：2017-12-12
申请号：US15082091
申请日：2016-03-28
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US08872195B2
公开(公告)日：2014-10-28
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：US09831406B2
公开(公告)日：2017-11-28
申请号：US14729771
申请日：2015-06-03
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US09991429B2
公开(公告)日：2018-06-05
申请号：US14794475
申请日：2015-07-08
Applicant: LG Innotek Co., Ltd.
Inventor： Satoshi Ozeki , Yuichiro Tanda
CPC classification number: H01L33/60 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device package may be provided that includes: a lead frame; a light emitting device disposed on the lead frame; a metallic reflector which is disposed on the lead frame, has a hollow portion in which the light emitting device is disposed, reflects light emitted from the light emitting device, and is formed by a mold; and a resin body which surrounds the lead frame and the reflector. The resin body includes an insulation layer disposed between the lead frame and the reflector, and a protrusion disposed on the reflector.
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公开(公告)号：US09893259B2
公开(公告)日：2018-02-13
申请号：US13924167
申请日：2013-06-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/642 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
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Patent Agency Ranking
公开(公告)号：US20140246604A1
公开(公告)日：2014-09-04
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na KIM , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：US08754423B2
公开(公告)日：2014-06-17
申请号：US14035700
申请日：2013-09-24
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
IPC: H01L25/075 , H01L33/02 , H01L33/44
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。
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公开(公告)号：US09887324B2
公开(公告)日：2018-02-06
申请号：US14484637
申请日：2014-09-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Baek Jun Kim , Hiroshi Kodaira , Byung Mok Kim , Ha Na Kim , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/486 , H01L33/36 , H01L33/44 , H01L33/48 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48145 , H01L2224/49107 , H01L2224/73265 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer.
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公开(公告)号：US09673357B2
公开(公告)日：2017-06-06
申请号：US14953254
申请日：2015-11-27
Applicant: LG Innotek Co., Ltd.
Inventor： Satoshi Ozeki , Yuichiro Tanda
CPC classification number: H01L33/483 , H01L33/46 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/16195 , H01L2924/00014
Abstract: An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.
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公开(公告)号：US09508906B2
公开(公告)日：2016-11-29
申请号：US14794476
申请日：2015-07-08
Applicant: LG Innotek Co., Ltd.
Inventor： Satoshi Ozeki , Yuichiro Tanda
CPC classification number: H01L33/56 , H01L24/97 , H01L33/486 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: A light emitting device package may be provided that includes: a lead frame which includes a first frame and a second frame disposed on both sides of the first frame respectively; a light emitting device which is disposed on the first frame and is electrically connected to the second frame; and a resin body which includes a first resin body which is disposed between the first frame and the second frame, and a second resin body which covers an outer surface of the lead frame. An end of the first frame and an end of the second frame are disposed on an outer surface of the second resin body.
Abstract translation: 可以提供一种发光器件封装，其包括：引线框架，其分别包括设置在第一框架两侧的第一框架和第二框架; 发光装置，其设置在所述第一框架上并电连接到所述第二框架; 以及树脂体，其包括设置在所述第一框架和所述第二框架之间的第一树脂体，以及覆盖所述引线框架的外表面的第二树脂体。 第一框架的端部和第二框架的端部设置在第二树脂体的外表面上。
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