Disclosed herein is a method of producing a film, the method being capable of suppressing formation of die lines in melt extrusion molding using a T die. A thermoplastic resin composition having a relaxation modulus of not less than 100 Pa and not more than 2,000 Pa is melted and kneaded, the relaxation modulus being measured under conditions of a temperature of 260° C., distortion of 1%, and a relaxation time of 1 second, and extrusion molding of the thermoplastic resin composition using the T die is performed to form the film. The thermoplastic resin composition may contain an acrylic resin and a rubber particle.