- 专利标题： Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
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申请号： US15792596申请日： 2017-10-24
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公开(公告)号： US10395964B2公开(公告)日： 2019-08-27
- 发明人: Matthew J. Busche , Vijay D. Parkhe , Michael R. Rice
- 申请人： APPLIED MATERIALS, INC.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 主分类号： H01L21/68
- IPC分类号： H01L21/68 ; H01L21/683 ; H01L21/67 ; G01N21/95
摘要：
An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.
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