公开(公告)号：US10121688B2

公开(公告)日：2018-11-06

申请号：US15481183

申请日：2017-04-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC: H01L21/683 ,  H05K7/20 ,  H01L21/67

Abstract: An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US09831111B2

公开(公告)日：2017-11-28

申请号：US14179339

申请日：2014-02-12

Applicant: Applied Materials, Inc.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC: G01J5/00 ,  G01K1/00 ,  G01K13/00 ,  H01L21/683 ,  H01L21/67 ,  G01N21/95

CPC classification number: H01L21/6833 ,  G01N21/9501 ,  H01L21/67103 ,  H01L21/67248

Abstract: An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

公开(公告)号：US10395964B2

公开(公告)日：2019-08-27

申请号：US15792596

申请日：2017-10-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/67 ,  G01N21/95

Abstract: An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.

公开(公告)号：US20180047607A1

公开(公告)日：2018-02-15

申请号：US15792596

申请日：2017-10-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Michael R. Rice

IPC: H01L21/683 ,  H01L21/67 ,  G01N21/95

CPC classification number: H01L21/6833 ,  G01N21/9501 ,  H01L21/67103 ,  H01L21/67248

Abstract: An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.