Invention Grant
- Patent Title: Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
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Application No.: US15792596Application Date: 2017-10-24
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Publication No.: US10395964B2Publication Date: 2019-08-27
- Inventor: Matthew J. Busche , Vijay D. Parkhe , Michael R. Rice
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/67 ; G01N21/95
Abstract:
An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha a chamber, a base to support a wafer chuck in the chamber, a heater to heat the chuck, a window through the exterior of the chamber, and an infrared imaging system to measure the temperature of the chuck while the chuck is heated.
Public/Granted literature
- US20180047607A1 APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK Public/Granted day:2018-02-15
Information query
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