Invention Grant
- Patent Title: Die attach methods and semiconductor devices manufactured based on such methods
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Application No.: US15663956Application Date: 2017-07-31
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Publication No.: US10396015B2Publication Date: 2019-08-27
- Inventor: Joachim Mahler , Benjamin Reichert , Chen Wen Lee , Giovanni Ragasa Garbin , Peter Strobel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016114463 20160804
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/00 ; H01L23/495 ; H01L21/56 ; H01L23/00
Abstract:
A semiconductor device includes a carrier, a semiconductor die and a die attach material arranged between the carrier and the semiconductor die. A fillet height of the die attach material is less than about 95% of a height of the semiconductor die. A maximum extension of the die attach material over edges of a main surface of the semiconductor die facing the die attach material is less than about 200 micrometers.
Public/Granted literature
- US20180040530A1 Die Attach Methods and Semiconductor Devices Manufactured based on Such Methods Public/Granted day:2018-02-08
Information query
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