• Patent Title: Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
  • Application No.: US14906263
    Application Date: 2014-06-25
  • Publication No.: US10396111B2
    Publication Date: 2019-08-27
  • Inventor: Arnold UmaliHarald EtschmaierGuenter Aflenzer
  • Applicant: ams AG
  • Applicant Address: AT Unterpremstaetten
  • Assignee: ams AG
  • Current Assignee: ams AG
  • Current Assignee Address: AT Unterpremstaetten
  • Agency: Fish & Richardson P.C.
  • Priority: EP13177174 20130719; EP13194925 20131128
  • International Application: PCT/EP2014/063413 WO 20140625
  • International Announcement: WO2015/007485 WO 20150122
  • Main IPC: H01L23/29
  • IPC: H01L23/29 H01L23/552 H01L27/146
Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor
Abstract:
A package for an optical sensor, comprises an optically opaque enclosure for forming a cavity when mounted onto a substrate and an optical element based on an optically translucent polymer. An aperture in the enclosure is designed to attach the optical element to the enclosure.
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