公开(公告)号：US20200184790A1

公开(公告)日：2020-06-11

申请号：US16345828

申请日：2017-10-19

Applicant: ams AG

Inventor： Harald Etschmaier ,  Nobuyoshi HIRAMATSU ,  Olesia Synooka

IPC: G08B17/107 ,  G08B17/113 ,  G01N21/53 ,  G01N21/21

Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member.

公开(公告)号：US11675049B2

公开(公告)日：2023-06-13

申请号：US16754335

申请日：2018-10-10

Applicant: ams AG

Inventor： Harald Etschmaier ,  Thomas Bodner

IPC: G01S7/481 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18 ,  G01S7/48 ,  G01S7/4865

CPC classification number: G01S7/4813 ,  G01S7/4808 ,  G01S7/4865 ,  G01S17/10 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/173 ,  H01L31/1876

Abstract: A method for fabricating a plurality of Time-of-Flight sensor devices (1) comprises a step of providing a wafer (100) including a plurality of wafer portions (110) for a respective one of the Time-of-Flight sensor devices (1), wherein each of the wafer portions (110) includes a first light detecting area (10) and a second light detecting area (20) and a respective light emitter device (30). The respective light emitter device (30) and the respective first light detecting area (10) is encapsulated by a first volume (40) of a light transparent material (130), and the respective second light detecting area (20) is encapsulated by a second volume (50) of the light transparent material (130). Before singulation of the devices (1), an opaque material (60) is placed on the wafer portions (110) in a space (120) between the respective first and second volume (40, 50) of the light transparent material (130).

公开(公告)号：US10741035B2

公开(公告)日：2020-08-11

申请号：US16345828

申请日：2017-10-19

Applicant: ams AG

Inventor： Harald Etschmaier ,  Nobuyoshi Hiramatsu ,  Olesia Synooka

IPC: G08B17/107 ,  G01N21/21 ,  G01N21/53 ,  G08B17/113 ,  G01N21/47

Abstract: The integrated smoke detection device comprises a carrier (1), a light source (2) arranged on or above the carrier, a light receiver (3) arranged on or above the carrier at a distance from the light source, and a polarizing member (7) arranged on or above the carrier, the light source emitting radiation (a, b) into the polarizing member. The polarizing member is configured to have a boundary surface (11) that linearly polarizes a reflected portion (d) of the radiation emitted by the light source, and an exit surface (12) that allows the reflected portion (d) to exit the polarizing member.

公开(公告)号：US20200225085A1

公开(公告)日：2020-07-16

申请号：US16633509

申请日：2018-07-18

Applicant: ams AG

Inventor： Harald Etschmaier ,  Klaus Schmidegg

IPC: G01J1/04

Abstract: The optical sensor package comprises an optical sensor device with a sensor element arranged inside a housing comprising a cap. A diffuser is arranged in an aperture of the cap opposite the sensor element and prolongs the cap in the aperture or closes the aperture. The method comprises forming a cap with an aperture, arranging a diffusing material in the aperture, thus forming a diffuser, and after forming the diffuser, arranging an optical sensor device with a sensor element inside a housing that includes the cap, such that the sensor element is opposite the diffuser.

公开(公告)号：US12140699B2

公开(公告)日：2024-11-12

申请号：US17272718

申请日：2019-09-02

Applicant: ams AG

Inventor： Harald Etschmaier ,  Klaus Schmidegg ,  James Eilertsen

IPC: G01S7/481 ,  G01S17/08 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173 ,  H01L31/18

Abstract: A method of manufacturing an optical sensor arrangement including the steps of providing a substrate having a surface and providing an integrated circuit comprising an optical detector arranged for detecting light of a desired wavelength range. The integrated circuit and a light emitter are mounted onto the surface, wherein the light emitter is arranged for emitting light in the desired wavelength range. The integrated circuit and the light emitter are electrically connected to each other and to the substrate. A light barrier is formed between the optical detector and the light emitter by dispensing a first optically opaque material along a profile of the integrated circuit. A mold layer is formed by at least partly encapsulating the substrate, the integrated circuit and the light emitter with an optically transparent material. A casing, made from a second optically opaque material, is mounted on the light barrier and thereby encloses a hollow space between the casing and the mold layer.

公开(公告)号：US10978507B2

公开(公告)日：2021-04-13

申请号：US16346273

申请日：2017-10-19

Applicant: ams AG

Inventor： Sonja Koenig ,  Bernhard Stering ,  Harald Etschmaier

IPC: H01L27/146

Abstract: A method for manufacturing optical sensor arrangements is provided. The method comprises providing at least two optical sensors on a carrier and providing a cover material on the side of the optical sensors facing away from the carrier. The method further comprises providing an aperture for each optical sensor on a top side of the cover material facing away from the carrier and forming at least one trench between the optical sensors from the carrier towards the top side of the cover material, the trench comprising inner walls. Moreover, the method comprises coating the inner walls with an opaque material, such that an inner volume of the trench is free of the opaque material, and singulating of the optical sensor arrangements along the at least one trench. Furthermore, a housing for an optical sensor is provided.

公开(公告)号：US10217715B2

公开(公告)日：2019-02-26

申请号：US15118469

申请日：2015-02-09

Applicant: ams AG

Inventor： Martin Schrems ,  Bernhard Stering ,  Harald Etschmaier

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485

Abstract: The semiconductor device comprises a semiconductor substrate (1) with a main surface (10) and a further main surface (11) opposite the main surface, a TSV (3) penetrating the substrate from the main surface to the further main surface, a metallization (13) of the TSV, an under-bump metallization (5) and a bump contact (6) at least partially covering the TSV at the further main surface. The TSV (3) comprises a cavity (15), which may be filled with a gas or liquid. An opening (15′) of the cavity is provided to expose the cavity to the environment.

公开(公告)号：US09842946B2

公开(公告)日：2017-12-12

申请号：US15317641

申请日：2015-05-22

Applicant: ams AG

Inventor： Rainer Minixhofer ,  Bernhard Stering ,  Harald Etschmaier

IPC: H01L31/02 ,  H01L31/0216 ,  H01L31/153 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L31/02164 ,  H01L27/14678 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/153 ,  H01L31/167 ,  H01L31/1876 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/48145 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The semiconductor device comprises a semiconductor substrate (1), a photosensor (2) integrated in the substrate (1) at a main surface (10), an emitter (12) of radiation mounted above the main surface (10), and a cover (6), which is at least partially transmissive for the radiation, arranged above the main surface (10). The cover (6) comprises a cavity (7), and the emitter (12) is arranged in the cavity (7). A radiation barrier (9) can be provided on a lateral surface of the cavity (7) to inhibit cross-talk between the emitter (12) and the photosensor (2).

公开(公告)号：US10396111B2

公开(公告)日：2019-08-27

申请号：US14906263

申请日：2014-06-25

Applicant: ams AG

Inventor： Arnold Umali ,  Harald Etschmaier ,  Guenter Aflenzer

IPC: H01L23/29 ,  H01L23/552 ,  H01L27/146

Abstract: A package for an optical sensor, comprises an optically opaque enclosure for forming a cavity when mounted onto a substrate and an optical element based on an optically translucent polymer. An aperture in the enclosure is designed to attach the optical element to the enclosure.

公开(公告)号：US20190161340A1

公开(公告)日：2019-05-30

申请号：US16098230

申请日：2017-05-05

Applicant: ams AG

Inventor： Harald Etschmaier ,  Anderson Singulani

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0048 ,  B81B3/0021 ,  B81B7/0058 ,  B81B2201/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2203/0127 ,  B81B2203/051

Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.