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公开(公告)号：US10396111B2
公开(公告)日：2019-08-27
申请号：US14906263
申请日：2014-06-25
Applicant: ams AG
Inventor： Arnold Umali , Harald Etschmaier , Guenter Aflenzer
IPC: H01L23/29 , H01L23/552 , H01L27/146
Abstract: A package for an optical sensor, comprises an optically opaque enclosure for forming a cavity when mounted onto a substrate and an optical element based on an optically translucent polymer. An aperture in the enclosure is designed to attach the optical element to the enclosure.
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