Invention Grant
- Patent Title: Optical module, manufacturing method thereof and electronic apparatus
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Application No.: US14947177Application Date: 2015-11-20
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Publication No.: US10396783B2Publication Date: 2019-08-27
- Inventor: Hsun-Wei Chan
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Priority: CN201410673430 20141120
- Main IPC: G01S7/481
- IPC: G01S7/481 ; H03K17/945 ; G01S17/02 ; H01L51/44 ; H01L31/0203

Abstract:
An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.
Public/Granted literature
- US20160146639A1 OPTICAL MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS Public/Granted day:2016-05-26
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