公开(公告)号：US11835363B2

公开(公告)日：2023-12-05

申请号：US17684374

申请日：2022-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

CPC classification number: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US09850124B2

公开(公告)日：2017-12-26

申请号：US14923602

申请日：2015-10-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Yu-Hsuan Tsai

IPC: H01L31/0232 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0067 ,  B81B2201/0292 ,  B81C1/00317 ,  B81C2203/0109 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/00014

Abstract: A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. The base substrate includes an inner sidewall. The inner sidewall of the base substrate defines a penetrating hole extending from a top surface of the base substrate to a bottom surface of the base substrate; at least a portion of the inner sidewall of the base substrate is tilted. The periphery barrier is coupled to the bottom surface of the base substrate and contacts a top surface of the carrier. The filter is disposed on the top surface of the base substrate and covers the penetrating hole.

公开(公告)号：US20170222093A1

公开(公告)日：2017-08-03

申请号：US15492808

申请日：2017-04-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

Abstract: An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.

公开(公告)号：US11776862B2

公开(公告)日：2023-10-03

申请号：US17027408

申请日：2020-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Han Chen ,  Hsun-Wei Chan ,  Mei-Yi Wu

IPC: H01L23/10 ,  H01L23/04 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/164 ,  H01L2924/16153 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

公开(公告)号：US11430906B2

公开(公告)日：2022-08-30

申请号：US16518792

申请日：2019-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin Tsai ,  Yu-Che Huang ,  Hsun-Wei Chan

IPC: H01L31/12

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US10689249B2

公开(公告)日：2020-06-23

申请号：US14855684

申请日：2015-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: B81B7/00

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

公开(公告)号：US10453760B2

公开(公告)日：2019-10-22

申请号：US15094178

申请日：2016-04-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin Tsai ,  Hsun-Wei Chan

IPC: H01L23/32 ,  H01L21/78 ,  H01L23/053 ,  H01L21/48 ,  H01L21/50

Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.

公开(公告)号：US10396783B2

公开(公告)日：2019-08-27

申请号：US14947177

申请日：2015-11-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan

IPC: G01S7/481 ,  H03K17/945 ,  G01S17/02 ,  H01L51/44 ,  H01L31/0203

Abstract: An optical module includes a substrate, a lid, a light-emitting component, a first sensor and a second sensor. The lid is disposed on a surface of the substrate. The lid defines a first opening, a second opening and a third opening. The second opening is between the first opening and the third opening. The light-emitting component is disposed on the surface of the substrate and in the first opening. The first sensor is disposed on the surface of the substrate and in the second opening. The second sensor is disposed on the surface of the substrate and in the third opening.

公开(公告)号：US11262197B2

公开(公告)日：2022-03-01

申请号：US16683117

申请日：2019-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US10910532B2

公开(公告)日：2021-02-02

申请号：US16198511

申请日：2018-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan

IPC: H01L33/58 ,  H01L25/16 ,  H01L33/52 ,  H01L33/60 ,  H03K17/00

Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.