Invention Grant
- Patent Title: Electronic component
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Application No.: US15669042Application Date: 2017-08-04
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Publication No.: US10405435B2Publication Date: 2019-09-03
- Inventor: Masahiro Wakashima , Yuta Saito , Kohei Shimada , Naobumi Ikegami
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-154708 20160805
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H01G2/06 ; H01G4/005 ; H01G4/12 ; H01G4/232 ; H05K1/02 ; H05K1/18

Abstract:
An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as W1 and W2, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as L1 and L2, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of W1 and L2, and of W2 and L1. The electronic component includes a third laminate and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer.
Public/Granted literature
- US20180042122A1 ELECTRONIC COMPONENT Public/Granted day:2018-02-08
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