Invention Grant
- Patent Title: Printed circuit board
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Application No.: US14931424Application Date: 2015-11-03
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Publication No.: US10405447B2Publication Date: 2019-09-03
- Inventor: Eric Bonnet
- Applicant: INGENICO GROUP
- Applicant Address: FR Paris
- Assignee: INGENICO GROUP
- Current Assignee: INGENICO GROUP
- Current Assignee Address: FR Paris
- Agency: Westman, Champlin & Koehler, P.A.
- Agent David D. Brush
- Priority: FR1460599 20141103
- Main IPC: G06K7/00
- IPC: G06K7/00 ; G07F7/08 ; H05K1/18 ; H05K7/02

Abstract:
A main printed circuit board, called a motherboard, of a payment terminal is provided on which a plurality of components is assembled. The components are assembled on the motherboard according to the height of the components so that the components of greater height are situated at a first end of the board and the components of smaller height are situated at a second end of the board.
Public/Granted literature
- US20160128218A1 Printed Circuit Board Public/Granted day:2016-05-05
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