Invention Grant
- Patent Title: Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
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Application No.: US15763446Application Date: 2016-07-26
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Publication No.: US10407598B2Publication Date: 2019-09-10
- Inventor: Takashi Mori , Hikaru Mizuno
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2015-189612 20150928; JP2016-120622 20160617
- International Application: PCT/JP2016/071876 WO 20160726
- International Announcement: WO2017/056662 WO 20170406
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46 ; C09J161/34 ; C08G16/02 ; C08G16/04 ; H01L21/683 ; C08G8/20 ; C08G8/30 ; C08G8/36 ; C09J161/14
Abstract:
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.
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