- 专利标题： Manufacturing method of semiconductor device and semiconductor device thereof
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申请号： US16107677申请日： 2018-08-21
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公开(公告)号： US10410993B2公开(公告)日： 2019-09-10
- 发明人: Yeong Beom Ko , Jin Han Kim , Dong Jin Kim , Do Hyung Kim , Glenn Rinne
- 申请人： Amkor Technology, Inc.
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 优先权： KR10-2014-0108365 20140820
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/00 ; H01L25/00 ; H01L21/683 ; H01L21/311 ; H01L25/065 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L21/56 ; H01L21/78 ; H01L23/31
摘要：
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method for manufacturing a semiconductor device that comprises ordering and performing processing steps in a manner that prevents warpage deformation from occurring to a wafer and/or die due to mismatching thermal coefficients.
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