Single interconnect index pointer for stacked die address encoding
Abstract:
Techniques for using a single thru-chip signal path to auto-identify and address each integrated circuit within a stack of integrated circuits upon power-up of stack. In an example, each integrated circuit of the stack can include a single auto-identify input terminal, a single auto-identify output terminal, and control logic configured to receive a logic state on the single auto-identify input terminal, to set an internal indicator to one of three states, and to control a state of the single auto-identify output terminal in response to a power up condition or to a change in the logic state of the single auto-identify input terminal.
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