Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15725519Application Date: 2017-10-05
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Publication No.: US10411003B2Publication Date: 2019-09-10
- Inventor: Naoki Okuno , Kosei Nei , Hiroaki Honda , Naoto Yamade , Hiroshi Fujiki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2016-202389 20161014
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/11519 ; H01L27/11565 ; H01L29/786 ; H01L27/11521

Abstract:
A transistor includes a first insulator over a substrate; a first oxide thereover; a second oxide in contact with at least part of the top surface of the first oxide; a first conductor and a second conductor each in contact with at least part of the top surface of the second oxide; a third oxide that is over the first conductor and the second conductor and is in contact with at least part of the top surface of the second oxide; a second insulator thereover; a third conductor which is over the second insulator and at least part of which overlaps with a region between the first conductor and the second conductor; and a third insulator which is over the third conductor and at least part of which is in contact with the top surface of the first insulator. The thickness of a region of the first insulator that is in contact with the third insulator is less than the thickness of a region of the first insulator that is in contact with the first oxide.
Public/Granted literature
- US20180108647A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-04-19
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