Invention Grant
- Patent Title: Output impedance calibration for signaling
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Application No.: US16154291Application Date: 2018-10-08
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Publication No.: US10411704B1Publication Date: 2019-09-10
- Inventor: Feng Lin
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Holland & Hart LLP
- Main IPC: H03K19/0175
- IPC: H03K19/0175 ; H03K19/00 ; G11C7/10 ; G11C5/06 ; G11C29/02 ; H03K19/0185

Abstract:
Methods, systems, and devices for output impedance calibration for signaling are described. Techniques are provided herein to adjust impedance levels associated with data transmitted using signaling and related techniques. In some cases, the signaling may be multi-level signaling. Such signaling may be configured to increase a data transfer rate without increasing the frequency of data transfer and/or a transmit power of the communicated data.
Public/Granted literature
- US20190296740A1 OUTPUT IMPEDANCE CALIBRATION FOR SIGNALING Public/Granted day:2019-09-26
Information query
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